Granted Patent
Utility
US 6,445,069 · App. 09/766,798
Electroless Ni/Pd/Au metallization structure for copper interconnect substrate and method therefor
Inventors:
Jamin Ling, Dave Charles Stepniak
Patented Case
View Patent ↗
Granted: Sep 3, 2002
Filed: Jan 22, 2001
Inventors
Jamin Ling
Dave Charles Stepniak
Assignee (at issue)
Flip Chip Technologies, L.L.C.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.