IP Library Granted Patent US 6,445,074
Granted Patent Utility
US 6,445,074 · App. 09/516,605

Electronic component mounted on a flat substrate and padded with a fluid filler

Inventors: Klaus-Peter Galuschki, Heinz Pilz
Patented Case View Patent ↗
Granted: Sep 3, 2002 Filed: Apr 3, 2000
Inventors
Klaus-Peter Galuschki
Heinz Pilz
Assignee (at issue)
Siemens Aktiengesellschaft

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Quick Facts
Patent No.
US 6,445,074
App. No.
09/516,605
Filed
2000-04-03
Granted
2002-09-03
Kind
B1