Granted Patent
Utility
US 6,445,075 · App. 09/770,859
Semiconductor module package substrate
Inventors:
Christopher M. Scanlan, Jon Aday
Patented Case
View Patent ↗
Granted: Sep 3, 2002
Filed: Jan 26, 2001
Inventors
Christopher M. Scanlan
Jon Aday
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.