Granted Patent
Utility
US 6,448,633 · App. 09/444,035
Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
Inventors:
Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Terry Davis, Chung Suk Han, Jae Hun Ku, Jae Sung Kwak, Sang-hyun Ryu
Patented Case
View Patent ↗
Granted: Sep 10, 2002
Filed: Nov 19, 1999
Inventors
Jae Hak Yee
Young Suk Chung
Jae Jin Lee
Terry Davis
Chung Suk Han
Jae Hun Ku
Jae Sung Kwak
Sang-hyun Ryu
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.