Granted Patent
Utility
US 6,452,802 · App. 09/898,212
Symmetrical package for semiconductor die
Inventors:
Allen K. Lam, Richard K. Williams, Alex K. Choi
Patented Case
View Patent ↗
Granted: Sep 17, 2002
Filed: Jul 2, 2001
Inventors
Allen K. Lam
Richard K. Williams
Alex K. Choi
Assignee (at issue)
ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.