Granted Patent
Utility
US 6,454,890 · App. 09/727,218
Method and apparatus for up to full width ultrasonic bonding
Inventors:
Jack L. Couillard, Robin Nason, Kent W. Abel
Patented Case
View Patent ↗
Granted: Sep 24, 2002
Filed: Nov 30, 2000
Inventors
Jack L. Couillard
Robin Nason
Kent W. Abel
Assignee (at issue)
Kimberly-Clark Worldwide, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.