Granted Patent
Utility
US 6,455,348 · App. 09/521,670
Lead frame, resin-molded semiconductor device, and method for manufacturing the same
Inventor:
Yukio Yamaguchi
Patented Case
View Patent ↗
Granted: Sep 24, 2002
Filed: Mar 8, 2000
Inventor
Yukio Yamaguchi
Assignee (at issue)
SUMITOMO ELECTRIC INDUSTRIES, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.