Granted Patent
Utility
US 6,455,413 · App. 09/894,525
Pre-fill CMP and electroplating method for integrated circuits
Inventors:
Christy Mei-Chu Woo, Minh Quoc Tran
Patented Case
View Patent ↗
Granted: Sep 24, 2002
Filed: Jun 27, 2001
Inventors
Christy Mei-Chu Woo
Minh Quoc Tran
Assignee (at issue)
Advanced Micro Devices, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.