Granted Patent
Utility
US 6,459,152 · App. 09/521,468
Semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface
Inventors:
Yoshihiro Tomita, Shinji Baba
Patented Case
View Patent ↗
Granted: Oct 1, 2002
Filed: Mar 8, 2000
Inventors
Yoshihiro Tomita
Shinji Baba
Assignee (at issue)
MITSUBISHI ELECTRIC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.