Granted Patent
Utility
US 6,461,485 · App. 09/229,564
Sputtering method for forming an aluminum or aluminum alloy fine wiring pattern
Inventors:
Kiyotsugu Mizouchi, Hiroshi Tsuji
Patented Case
View Patent ↗
Granted: Oct 8, 2002
Filed: Jan 13, 1999
Inventors
Kiyotsugu Mizouchi
Hiroshi Tsuji
Assignee (at issue)
Kabushiki Kaisha Toshiba
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.