Granted Patent
Utility
US 6,462,274 · App. 09/422,027
Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages
Inventors:
Il Kwon Shim, Chang Kyu Park, Byung Joon Han, Vincent DiCaprio, Paul R. Hoffman
Patented Case
View Patent ↗
Granted: Oct 8, 2002
Filed: Oct 20, 1999
Inventors
Il Kwon Shim
Chang Kyu Park
Byung Joon Han
Vincent DiCaprio
Paul R. Hoffman
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.