Granted Patent
Utility
US 6,465,330 · App. 09/387,705
Method for grinding a wafer back
Inventors:
Kazuhiro Takahashi, Kazuyoshi Ebe, Shinya Takyu
Patented Case
View Patent ↗
Granted: Oct 15, 2002
Filed: Aug 18, 1999
Inventors
Kazuhiro Takahashi
Kazuyoshi Ebe
Shinya Takyu
Assignees (at issue)
LINTEC CORPORATION
Kabushiki Kaisha Toshiba
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.