Granted Patent
Utility
US 6,468,413 · App. 09/697,333
Electrochemical etch for high tin solder bumps
Inventors:
Lisa A. Fanti, John M. Cotte, David E. Eichstadt
Patented Case
View Patent ↗
Granted: Oct 22, 2002
Filed: Oct 26, 2000
Inventors
Lisa A. Fanti
John M. Cotte
David E. Eichstadt
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.