Granted Patent
Utility
US 6,469,376 · App. 09/803,045
Die support structure
Inventor:
Venkateshwaran Vaiyapuri
Patented Case
View Patent ↗
Granted: Oct 22, 2002
Filed: Mar 12, 2001
Inventor
Venkateshwaran Vaiyapuri
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.