Granted Patent
Utility
US 6,469,398 · App. 10/101,730
Semiconductor package and manufacturing method thereof
Inventor:
Tetsuji Hori
Patented Case
View Patent ↗
Granted: Oct 22, 2002
Filed: Mar 21, 2002
Inventor
Tetsuji Hori
Assignee (at issue)
Kabushiki Kaisha Toshiba
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.