Granted Patent
Utility
US 6,472,291 · App. 09/492,541
Planarization process to achieve improved uniformity across semiconductor wafers
Inventors:
Joseph E. Page, Jr., Jonathan Philip Davis, Scott William Hill Bailey
Patented Case
View Patent ↗
Granted: Oct 29, 2002
Filed: Jan 27, 2000
Inventors
Joseph E. Page, Jr.
Jonathan Philip Davis
Scott William Hill Bailey
Assignees (at issue)
Infineon Technologies North America Corp.
Infineon Technologies Richmond, LP
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.