Granted Patent
Utility
US 6,472,293 · App. 09/997,878
Method for manufacturing an interconnect structure for stacked semiconductor device
Inventor:
Tadatomo Suga
Patented Case
View Patent ↗
Granted: Oct 29, 2002
Filed: Nov 30, 2001
Inventor
Tadatomo Suga
Assignees (at issue)
OKI ELECTRIC INDUSTRY CO., LTD.
SANYO ELECTRIC CO., LTD.
SONY GROUP CORPORATION
Kabushiki Kaisha Toshiba
NEC CORPORATION
SHARP KABUSHIKI KAISHA
HITACHI, LTD.
Fujitsu Limited
Matsushita Electronics Corporation
MITSUBISHI ELECTRIC CORPORATION
ROHM CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.