IP Library Granted Patent US 6,472,309
Granted Patent Utility
US 6,472,309 · App. 09/505,608

In situ plasma pre-deposition wafer treatment in chemical vapor deposition technology for semiconductor integrated circuit applications

Inventor: Weimin Li
Patented Case View Patent ↗
Granted: Oct 29, 2002 Filed: Feb 17, 2000
Inventor
Weimin Li
Assignee (at issue)
Micron Technology, Inc.

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,472,309
App. No.
09/505,608
Filed
2000-02-17
Granted
2002-10-29
Kind
B1