Granted Patent
Utility
US 6,472,763 · App. 09/725,146
Semiconductor device with bumps for pads
Inventors:
Tomoyuki Fukuda, Eiji Watanabe
Patented Case
View Patent ↗
Granted: Oct 29, 2002
Filed: Nov 29, 2000
Inventors
Tomoyuki Fukuda
Eiji Watanabe
Assignee (at issue)
Fujitsu Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.