Granted Patent
Utility
US 6,473,883 · App. 09/997,437
Integrated circuit performance and reliability using angle measurement for a patterned bump layout on a power grid
Inventors:
Sudhakar Bobba, Tyler Thorp
Patented Case
View Patent ↗
Granted: Oct 29, 2002
Filed: Nov 29, 2001
Inventors
Sudhakar Bobba
Tyler Thorp
Assignee (at issue)
Sun Microsystems Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.