Granted Patent
Utility
US 6,474,529 · App. 09/987,807
Wire bonding apparatus
Inventors:
Toshiaki Yamaguchi, Noriyuki Kubota
Patented Case
View Patent ↗
Granted: Nov 5, 2002
Filed: Nov 16, 2001
Inventors
Toshiaki Yamaguchi
Noriyuki Kubota
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.