IP Library Granted Patent US 6,475,897
Granted Patent Utility
US 6,475,897 · App. 09/639,709

Semiconductor device and method of forming semiconductor device

Inventor: Takashi Hosaka
Patented Case View Patent ↗
Granted: Nov 5, 2002 Filed: Aug 14, 2000
Inventor
Takashi Hosaka
Assignee (at issue)
SEIKO INSTRUMENTS INC.

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Quick Facts
Patent No.
US 6,475,897
App. No.
09/639,709
Filed
2000-08-14
Granted
2002-11-05
Kind
B1