IP Library Granted Patent US 6,476,330
Granted Patent Utility
US 6,476,330 · App. 09/731,933

Wiring substrate and process for producing the same

Inventors: Kanji Otsuka, Tamotsu Usami
Patented Case View Patent ↗
Granted: Nov 5, 2002 Filed: Dec 8, 2000
Inventors
Kanji Otsuka
Tamotsu Usami
Assignees (at issue)
SANYO ELECTRIC CO., LTD.
OKI ELECTRIC INDUSTRY CO., LTD.
SHARP KABUSHIKI KAISHA
SONY GROUP CORPORATION
Kabushiki Kaisha Toshiba
NEC CORPORATION
HITACHI, LTD.
Fujitsu Limited
Matsushita Electronics Corporation
MITSUBISHI ELECTRIC CORPORATION
ROHM CO., LTD.
Kanji Otsuka
Tamotsu Usami

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Quick Facts
Patent No.
US 6,476,330
App. No.
09/731,933
Filed
2000-12-08
Granted
2002-11-05
Kind
B2