Granted Patent
Utility
US 6,476,331 · App. 09/783,797
Printed circuit board for semiconductor package and method for manufacturing the same
Inventors:
Sung Jin Kim, Sun Jin Son
Patented Case
View Patent ↗
Granted: Nov 5, 2002
Filed: Feb 14, 2001
Inventors
Sung Jin Kim
Sun Jin Son
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.