Granted Patent
Utility
US 6,476,478 · App. 09/439,917
Cavity semiconductor package with exposed leads and die pad
Inventors:
Gary L. Swiss, Angel Orabuena Alvarez
Patented Case
View Patent ↗
Granted: Nov 5, 2002
Filed: Nov 12, 1999
Inventors
Gary L. Swiss
Angel Orabuena Alvarez
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.