Granted Patent
Utility
US 6,476,482 · App. 09/588,189
Chip-size integrated circuit package having slits formed in an insulator tape
Inventors:
Shohei Okazaki, Yoshihiro Matsumoto
Patented Case
View Patent ↗
Granted: Nov 5, 2002
Filed: Jun 7, 2000
Inventors
Shohei Okazaki
Yoshihiro Matsumoto
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.