Granted Patent
Utility
US 6,476,506 · App. 09/966,584
Packaged semiconductor with multiple rows of bond pads and method therefor
Inventors:
Shawn O'Connor, Mark A. Gerber, Jean Desiree Miller
Patented Case
View Patent ↗
Granted: Nov 5, 2002
Filed: Sep 28, 2001
Inventors
Shawn O'Connor
Mark A. Gerber
Jean Desiree Miller
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.