Granted Patent
Utility
US 6,479,893 · App. 09/728,390
Ball-less clip bonding
Inventors:
Saat Shukri Embong, Chee Chew Hiong
Patented Case
View Patent ↗
Granted: Nov 12, 2002
Filed: Dec 4, 2000
Inventors
Saat Shukri Embong
Chee Chew Hiong
Assignee (at issue)
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.