Granted Patent
Utility
US 6,480,074 · App. 09/845,096
Method and system for wafer-level tuning of bulk acoustic wave resonators and filters by reducing thickness non-uniformity
Inventors:
Jyrki Kaitila, Pasi Tikka, Juha Ellä
Patented Case
View Patent ↗
Granted: Nov 12, 2002
Filed: Apr 27, 2001
Inventors
Jyrki Kaitila
Pasi Tikka
Juha Ellä
Assignee (at issue)
Nokia Mobile Phones Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.