Granted Patent
Utility
US 6,482,307 · App. 09/735,546
Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing
Inventors:
Jalal Ashjaee, Boguslaw Nagorski, Bulent M. Basol, Homayoun Talieh, Cyprian Emeka Uzoh
Patented Case
View Patent ↗
Granted: Nov 19, 2002
Filed: Dec 14, 2000
Inventors
Jalal Ashjaee
Boguslaw Nagorski
Bulent M. Basol
Homayoun Talieh
Cyprian Emeka Uzoh
Assignee (at issue)
Nutool, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.