Granted Patent
Utility
US 6,483,128 · App. 09/793,793
Connecting device for power semiconductor modules with compensation for mechanical stresses
Inventors:
Manfred Loddenkotter, Thilo Stolze
Patented Case
View Patent ↗
Granted: Nov 19, 2002
Filed: Feb 26, 2001
Inventors
Manfred Loddenkotter
Thilo Stolze
Assignee (at issue)
EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.