Granted Patent
Utility
US 6,483,191 · App. 09/865,000
Semiconductor device having reinforced coupling between solder balls and substrate
Inventor:
Nobuyuki Umezaki
Patented Case
View Patent ↗
Granted: Nov 19, 2002
Filed: May 24, 2001
Inventor
Nobuyuki Umezaki
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.