Granted Patent
Utility
US 6,484,393 · App. 08/956,642
Method for wire bonding to flexible substrates
Inventor:
Alex Chan
Patented Case
View Patent ↗
Granted: Nov 26, 2002
Filed: Oct 23, 1997
Inventor
Alex Chan
Assignee (at issue)
Agilent Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.