IP Library Granted Patent US 6,486,052
Granted Patent Utility
US 6,486,052 · App. 09/642,806

Package having terminated plating layer and its manufacturing method

Inventor: Ryoji Sato
Patented Case View Patent ↗
Granted: Nov 26, 2002 Filed: Aug 22, 2000
Inventor
Ryoji Sato
Assignee (at issue)
NEC CORPORATION

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Quick Facts
Patent No.
US 6,486,052
App. No.
09/642,806
Filed
2000-08-22
Granted
2002-11-26
Kind
B1