Granted Patent
Utility
US 6,486,537 · App. 09/812,426
Semiconductor package with warpage resistant substrate
Inventor:
Markus K. Liebhard
Patented Case
View Patent ↗
Granted: Nov 26, 2002
Filed: Mar 19, 2001
Inventor
Markus K. Liebhard
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.