Granted Patent
Utility
US 6,486,562 · App. 09/588,357
Circuit device with bonding strength improved and method of manufacturing the same
Inventor:
Kaneyuki Kato
Patented Case
View Patent ↗
Granted: Nov 26, 2002
Filed: Jun 7, 2000
Inventor
Kaneyuki Kato
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.