Granted Patent
Utility
US 6,486,563 · App. 09/619,017
Wafer scale packaging scheme
Inventor:
Mou-Shiung Lin
Patented Case
View Patent ↗
Granted: Nov 26, 2002
Filed: Jul 19, 2000
Inventor
Mou-Shiung Lin
Assignee (at issue)
Megica Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.