Granted Patent
Utility
US 6,489,083 · App. 09/677,496
Selective sizing of features to compensate for resist thickness variations in semiconductor devices
Inventors:
Bradley P. Smith, Edward O. Travis, Sejal Chheda, Ruiqi Tian
Patented Case
View Patent ↗
Granted: Dec 3, 2002
Filed: Oct 2, 2000
Inventors
Bradley P. Smith
Edward O. Travis
Sejal Chheda
Ruiqi Tian
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.