Granted Patent
Utility
US 6,489,229 · App. 09/949,454
Method of forming a semiconductor device having conductive bumps without using gold
Inventors:
Devin Robert Sheridan, Larry J. Larsen, Martie D. Knauss
Patented Case
View Patent ↗
Granted: Dec 3, 2002
Filed: Sep 7, 2001
Inventors
Devin Robert Sheridan
Larry J. Larsen
Martie D. Knauss
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.