Granted Patent
Utility
US 6,489,235 · App. 09/753,548
Method of forming a metal seed layer for subsequent plating
Inventors:
Terry L. Gilton, Dinesh Chopra
Patented Case
View Patent ↗
Granted: Dec 3, 2002
Filed: Jan 4, 2001
Inventors
Terry L. Gilton
Dinesh Chopra
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.