Granted Patent
Utility
US 6,489,571 · App. 09/703,199
Molded tape ball grid array package
Inventors:
Chok J. Chia, Qwai H. Low, Patrick Variot
Patented Case
View Patent ↗
Granted: Dec 3, 2002
Filed: Oct 31, 2000
Inventors
Chok J. Chia
Qwai H. Low
Patrick Variot
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.