Granted Patent
Utility
US 6,489,634 · App. 09/938,073
Microelectronic device structure utilizing a diamond inlay in a package flange
Inventors:
Christopher P. Schaffer, Steven R. Burkhart, Bartley J. Price
Patented Case
View Patent ↗
Granted: Dec 3, 2002
Filed: Aug 22, 2001
Inventors
Christopher P. Schaffer
Steven R. Burkhart
Bartley J. Price
Assignee (at issue)
The Boeing Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.