Granted Patent
Utility
US 6,489,676 · App. 09/843,912
Semiconductor device having an interconnecting post formed on an interposer within a sealing resin
Inventors:
Fumihiko Taniguchi, Akira Takashima
Patented Case
View Patent ↗
Granted: Dec 3, 2002
Filed: Apr 30, 2001
Inventors
Fumihiko Taniguchi
Akira Takashima
Assignee (at issue)
Fujitsu Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.