Granted Patent
Utility
US 6,489,678 · App. 09/285,191
High performance multi-chip flip chip package
Inventor:
Rajeev Joshi
Patented Case
View Patent ↗
Granted: Dec 3, 2002
Filed: Mar 15, 1999
Inventor
Rajeev Joshi
Assignee (at issue)
FAIRCHILD SEMICONDUCTOR CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.