Granted Patent
Utility
US 6,489,688 · App. 09/847,948
Area efficient bond pad placement
Inventors:
Doug Baumann, Louis Pandula
Patented Case
View Patent ↗
Granted: Dec 3, 2002
Filed: May 2, 2001
Inventors
Doug Baumann
Louis Pandula
Assignee (at issue)
Zeevo, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.