Granted Patent
Utility
US 6,492,280 · App. 09/517,387
Method and apparatus for etching a semiconductor wafer with features having vertical sidewalls
Inventors:
Stephen P. DeOrnellas, Alferd Cofer, Paritosh Rajora
Patented Case
View Patent ↗
Granted: Dec 10, 2002
Filed: Mar 2, 2000
Inventors
Stephen P. DeOrnellas
Alferd Cofer
Paritosh Rajora
Assignee (at issue)
TEGAL CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.