Granted Patent
Utility
US 6,492,739 · App. 10/103,988
Semiconductor device having bumper portions integral with a heat sink
Inventors:
Kuniharu Muto, Atsushi Nishikizawa, Jyunichi Tsuchiya, Toshiyuki Hata, Nobuya Koike, Ichio Shimizu
Patented Case
View Patent ↗
Granted: Dec 10, 2002
Filed: Mar 25, 2002
Inventors
Kuniharu Muto
Atsushi Nishikizawa
Jyunichi Tsuchiya
Toshiyuki Hata
Nobuya Koike
Ichio Shimizu
Assignees (at issue)
HITACHI, LTD.
Hitachi Tohbu Semiconductor, Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.