Granted Patent
Utility
US 6,495,398 · App. 09/755,018
Wafer-scale package for surface acoustic wave circuit and method of manufacturing the same
Inventor:
Martin Goetz
Patented Case
View Patent ↗
Granted: Dec 17, 2002
Filed: Jan 5, 2001
Inventor
Martin Goetz
Assignee (at issue)
Clarisay, Incorporated
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.