Granted Patent
Utility
US 6,495,451 · App. 09/753,675
Method of forming interconnect
Inventors:
Tsukasa Hattori, Takashi Matsuda, Hiroshi Masuda, Tetsuya Ueda
Patented Case
View Patent ↗
Granted: Dec 17, 2002
Filed: Jan 4, 2001
Inventors
Tsukasa Hattori
Takashi Matsuda
Hiroshi Masuda
Tetsuya Ueda
Assignee (at issue)
SUMITOMO ELECTRIC INDUSTRIES, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.