IP Library Granted Patent US 6,498,052
Granted Patent Utility
US 6,498,052 · App. 09/974,001

Circuit, method of adhering an integrated circuit device to a substrate, and method of forming a circuit

Inventor: Joseph Brand
Patented Case View Patent ↗
Granted: Dec 24, 2002 Filed: Oct 9, 2001
Inventor
Joseph Brand
Assignee (at issue)
Micron Technology, Inc.

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Quick Facts
Patent No.
US 6,498,052
App. No.
09/974,001
Filed
2001-10-09
Granted
2002-12-24
Kind
B2